Cleanrooms and Semiconductor Facilities

We stand ready to engage in a productive synergy with Semiconductor Fabs in Mexico

As the semiconductor industry pushes toward sub-5nm nodes, the margin for error has effectively vanished. DAVRU Engineering offers solutions which integrate cutting-edge automation with deep data sovereignty to ensure your facility meets the rigorous demands of modern chip density while upholding the gold standard of Copy Exactly compliance.

DAVRU Engineering specializes in the full-lifecycle construction of both Front-End (wafer fabrication) and Back-End (assembly, testing, and packaging) facilities. With a proven track record in achieving ISO Class 1 (ISO 14644) certification in Mexico, we provide the infrastructure required for advanced lithography, wafer processes and packaging.

Our Capabilities

Front-End Fabrication Processes
We design and construct the core "cleanroom within a cleanroom" architecture to support sophisticated toolsets. We offer a vast experience on the installation of Chemical Vapor Deposition Systems ((PECVD, LPCVD, MOCVD, MWCVD), Physical Vapor Deposition Systems PVD (E-beam Evaporators, Thermal Evaporators, Multiple Sputtering RF and DC), Atomic Layer Deposition, Etching Systems, Multiple Photolithography tools and more.

Back-End Assembly & Packaging Processes
We provide the ideal environment to reach an allow for slightly higher particle tolerances, the complexity of Advanced Packaging and testing tools to produce Chips.

Semiconductor Fab Engineering
Modern construction is no longer just about the physical shell; it is about the digital nervous system.These integrated solutions are essential pillars for scaling production. By adopting these technologies, manufacturers can significantly increase chip density, minimize waste, and ensure that every facility globally adheres to the strict Processes, Standards and Regulations

ISO Class 1-3 Cleanrooms: Integration of Systems to produce laminar flow to maintain particle counts at the theoretical limit of Class 1 (ISO 14644).
Simulation & Modeling: Utilizing Advance Software to simulate airflow, thermal gradients, and MEP (Mechanical, Electrical, and Plumbing) routing before the first stone is laid.
Automated Material Handling Integration: Structural preparation for Overhead Hoist Transfers (OHTs) and automated stockers, ensuring the facility is ready for full robotic autonomy.
Modular Cleanroom Scalability: We provide flexible cleanroom layouts that allow for rapid reconfiguration as packaging technologies evolve from traditional wire bonding to advanced TSV (Through-Silicon Via) processes.
ESD & Molecular Contamination Control: Specialized flooring and conductive surfaces to eliminate Electrostatic Discharge (ESD) and Airborne Molecular Contamination (AMC), which are critical for protecting finished dies.
Vibration Isolation & Structural Integrity: Implementation of "waffle table" flooring and specialized sub-fab foundations to mitigate micro-vibrations that can disrupt extreme ultraviolet (EUV) lithography.